大电流降压方案LM5119

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123456AAH5FID1H11902CNY PMS 440 0025 PHH2H61902CNY PMS 440 0025 PHPCB Number:XX####PCB Rev:E1H7H31902CNY PMS 440 0025 PHFID2H41902CNY PMS 440 0025 PHH8PCBLOGOTexas InstrumentsBBFID3LBL1PCB LabelSize: 0.65" x 0.20 "ZZ1Label Assembly NoteThis Assembly Note is for PCB labels onlyCZZ2Assembly NoteThese assemblies are ESD sensitive, ESD precautions shall be 3Assembly NoteThese assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not 4Assembly NoteThese assemblies must comply with workmanship standards IPC-A-610 Class 2., unless otherwise igned for:Public ReleaseMod. Date:8/16/2013Project Title:Change in menu Project|Project Options|ParametersNumber:XX####Rev:E1Sheet Title:Texas Instruments and/or its licensors do not warrant the accuracy or completeness of this specification or any information contained therein. Texas Instruments and/or its licensors do not SVN Rev:Not in version controlAssembly Variant:001Sheet:1of1warrant that this design will meet the specifications, will be suitable for your application or fit for any particular purpose, or will operate in an implementation. Texas Instruments and/or its Drawn By:File:PMP7990_Hardware_Size:Bensors do not warrant that the design is production worthy. You should completely validate and test your design implementation to confirm the system functionality for your er:Enter name of project leadContact:/support© Texas Instruments2012123456

123456Revision HistoryRevisionNotesAABBPlace Block Diagram here (if appropriate) or delete this text using a block diagram from another tool, save the picture as a .bmp

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on the signed for:Public ReleaseMod. Date:8/16/2013Project Title:Change in menu Project|Project Options|ParametersNumber:XX####Rev:E1Sheet Title:Texas Instruments and/or its licensors do not warrant the accuracy or completeness of this specification or any information contained therein. Texas Instruments and/or its licensors do not SVN Rev:Not in version controlAssembly Variant:001Sheet:1of1warrant that this design will meet the specifications, will be suitable for your application or fit for any particular purpose, or will operate in an implementation. Texas Instruments and/or its Drawn By:File:PMP7990_Cover Sheet_Size:Bensors do not warrant that the design is production worthy. You should completely validate and test your design implementation to confirm the system functionality for your er:Enter name of project leadContact:/support© Texas Instruments2012123456

123456COR2R210.0kPIR202PIR201COVINVINPIR101COR1R10RevisionRevision HistoryNotesInput Voltage = 33Vin to 60VinCOD1D1BAT46W-7-FPIR102COJ1J11AVIN1PIJ101PIVIN01PIR302PIR402COR5R52.49k3102-2-00-21-00-00-08-0COR3R31.00PIR301COR4R4133kPIC401PIC402GNDPID101PID102PIC101PIC201PIC301COC1COC2COC3C1C2C3PIC1022.2uFPIC2022.2uFPIC3022.2uFCOD4D4BAT46W-7-FACOC4C41µFLM5119VINUVLOFB1COMP1RAMP1SS1RTRESDEMBVCCDISEN2VCC1HB1HO1SW1LO1CS1CSG1VCC2PGND1HB2HO2SW2LO2CS2CSG2DAPPGND21GNDGND3102-2-00-21-00-00-08-0PIU1029295,6,7,81,2,3PIR701UVLOFB1COMP1COU1U1VCC1COJ2J211PIJ201GNDPIR60110.0kCOC8C8100pFPIR7025,6,7,8COGND VGND V0.1uFCOR6R6PIQ2098765PIQ2031PIQ3098765PIQ30214PIQ204COQ2Q2BSC123N08NS3 G80V5,6,7,81,2,3PIGND V01PIR501COC6C6PIR502PIR401PIR602COC5C50.1µF5,6,7,8COD2D2BAT46W-7-FGNDPID20PID201COR7R773.2kVIN U1PIC702PIC701PID402PID401COC7C70.1µFGNDGNDGNDPIQ1098765PIQ1032PIQ1044COQ1Q1BSC123N08NS3 G80VCOL1L1PIU101PIR902PIR901PIC1301PIC1302COR9R9GND28PIU1028PIU109PIU101030HB1PIU1030PIU1031PIU1032COD5D5PID502COQ3Q3BSC047N08NS3 GPIQ4098765PIQ40321COQ4Q480V3.32kPIC1011,2,3COC13C130.047µFBPIC102100pF1032HO1_NCOR25R25PIR2501PIR25021,2,3COC11C11931HO1_P4PID501PIQ30480V4PIQ404PIC1201VER2923-103KLCOC1210.0µHC12PIC12022700pFPIR801PIL101PIL102COVOUTVOUTCOJ3VOUT1J31PIJ3011PIC1501COC15C152200pFPIC1502GNDCOC14C14GND0.1uFPIC1402RAMP1SS1PIC1401COR11R11PIR11026PIU1067PIU107PIU1013PIU10142LO1PIU1025CS1PIU105PIU104PIU1024100CS1_P0.7VCOC25C25100pFCOR10R10COD6D6PID601PIR802COR8R81.00PIC901PIC101COC9COC10C9C10PIC9032EEF-CD1B220RPIC1032EEF-CD1B220RCOGNDGND3144-2-00-21-00-00-08-012Vout @ 30ACOJ4J41PIJ4011B3144-2-00-21-00-00-08-0PIGND01GNDGNDCOR26R26PIR26020.005PID602PIC2502PIC2501PIR2601GND3PIR1302COC23C232200pFGNDCOR13R130COC17C17100pFGNDVCCDIS8PIU108PIEN201PIU1027PIU1026PIU102527HB226HO2_P25HO2_N23LO2COC19C19GND0.1µF34.99k1uFPIC1602PIC1601SYNCPIC1701PIC1702COSyncSyncPISync01COC16C162RESDEMB1424VCC2PID302COD3D317PIU10173PIU103PID301GND2PIR1101RT134CSG1100PIQ901PIQ902PIQ903COQ9Q90.7V11PIQ1001COQ10COC18C181µF2DB1694-7Q102DB1694-7PITP OUT01COTP OUTTP OUTPIC1901PIC1902PIC201PIC201PIC2101COC20COC22C20C22PIC2022.2uFPIC2022.2uFPIC2102COC21C212.2uFCOR24R2449.9PITP IN01PIR1301COEN2EN2EN2PIU101111GNDCOTP INTP INGND5,6,7,8PIU1020PIU1021PIU1022PIU10161612FB2AGND2122CSG2GNDCOC26C26PIC2602PIC2601COQ5Q5BSC123N08NS3 GPIQ504480VPIQ60445,6,7,81,2,3GNDCPIU1012PIR2802PIR28015,6,7,8COR28R28100R27COR27100PIU103COD7D740.7VCS2_PPIQ709865PIQ70321COQ7Q780VPIQ809765PIQ803211,2,3100pF5,6,7,8RAMP219PIU1019RAMP2COC24C24SS2PIU101818PIC2402PIC2401SS20.1uF15PIU1015COMP2PIU102320CS2PIQ509876PIQ609875PIQ60321GNDCOQ6GNDQ6BSC123N08NS3 G80VCOL2L2PIL201PIC2901COC29C29PIC29022700pFPIR1601PIL202GNDVER2923-103KL10.0µH33PID702PID701PIQ704PIQ80441,2,31,2,3COQ8Q880VPIC2701PIC2801COC27COC28C27C28PIC27032EEF-CD1B220RPIC28032EEF-CD1B220RGNDGNDCGNDCOR19R190.005COD8D80.7V1PIR1602COR16R161.00COR18R1869.8kPID802PID801GND2GNDPIR230173.2kPIQ110112PIQ1201PIR2302COR23R23PIQ102PIQ103COQ11Q11COQ12Q122DB1694-72DB1694-73GND3DCOR22R224.99kDGNDDesigned for:Public ReleaseMod. Date:8/19/2013National Semiconductor and/or its licensors do not warrant the accuracy or completeness of

Project:Change in menu Project|Project Options|Parametersthis specification or any information contained therein. National and/or its licensors do not

Sheet Title:Cover SheetSheet:1of2warrant that this design will meet the specifications, will be suitable for your application or fit

Size:BSchematic:870PRJ_BasePNRev:E1for any particular purpose, or will operate in an implementation. National and/or its licensors

Assembly Variant:001do not warrant that the design is production worthy. You should completely validate and test

File:r design implementation to confirm the system functionality for your t:/support© Copyright, National Semiconductor, 2009123456

IMPORTANTNOTICEFORTIREFERENCEDESIGNSTexasInstrumentsIncorporated("TI")referencedesignsaresolelyintendedtoassistdesigners(“Buyers”)whoaredevelopingsystemsthatincorporateTIsemiconductorproducts(alsoreferredtohereinas“components”).BuyerunderstandsandagreesthatBuyerremainsresponsibleforusingitsindependentanalysis,evaluationandjudgmentindesigningBuyer’rencedesignshavebeenotconductedanytestingotherthanthatspecificallydeakecorrections,enhancements,areauthorizedtouseTIreferencedesignswiththeTIcomponent(s)identifiedineachparticularreferencedesignR,NOOTHERLICENSE,EXPRESSORIMPLIED,BYESTOPPELOROTHERWISETOANYOTHERTIINTELLECTUALPROPERTYRIGHT,ANDNOLICENSETOANYTHIRDPARTYTECHNOLOGYORINTELLECTUALPROPERTYRIGHT,ISGRANTEDHEREIN,includingbutnotlimitedtoanypatentright,copyright,maskworkright,orotherintellectualpropertyrightrelatingtoanycombination,machine,ationpublishedbyTIregardingthird-partyproductsorservicesdoesnotconstitutealicensetousesuchproductsorservices,uchinformationmayrequirealicensefromathirdpartyunderthepatentsorotherintellectualpropertyofthethirdparty,RENCEDESIGNSAREPROVIDED"ASIS".TIMAKESNOWARRANTIESORREPRESENTATIONSWITHREGARDTOTHEREFERENCEDESIGNSORUSEOFTHEREFERENCEDESIGNS,EXPRESS,IMPLIEDORSTATUTORY,LAIMSANYWARRANTYOFTITLEANDANYIMPLIEDWARRANTIESOFMERCHANTABILITY,FITNESSFORAPARTICULARPURPOSE,QUIETENJOYMENT,QUIETPOSSESSION,ANDNON-INFRINGEMENTOFANYTHIRDPARTYINTELLNOTBELIABLEFORANDSHALLNOTDEFENDORINDEMNIFYBUYERSAGAINSTANYTHIRDPARTYINFRINGEMENTCLAIMTHATRELATESTOENTSHALLTIBELIABLEFORANYACTUAL,SPECIAL,INCIDENTAL,CONSEQUENTIALORINDIRECTDAMAGES,HOWEVERCAUSED,ONANYTHEORYOFLIABILITYANDWHETHERORNOTTIHASBEENADVISEDOFTHEPOSSIBILITYOFSUCHDAMAGES,ARISINGINANYWAYOUTOFTIREFERENCEDESIGNSORBUYER’rvestherighttomakecorrections,enhancements,improvementsandotherchangestoitssemiconductorproductsandservicesperJESD46,latestissue,andtodiscontinueanyproductorserviceperJESD48,shouldobtainthelatestrelevantinformationbeforeplaciconductorproductsaresoldsubjecttoTI’antsperformanceofitscomponentstothespecificationsapplicableatthetimeofsale,inaccordancewiththewarrantyinTI’gandotherqualitycontroltechniquesforTIcowheremandatedbyapplicablelaw,mesnoliabilityforapplicationsassistanceorthedesignofBuyers’mizetherisksassociatedwithBuyers’productsandapplications,uctionofsignificantportionsofTIinformationinTIdatabooks,datasheetsorreferencedesignsispermissibleonlyifreproductioniswithoutalterationandisaccompaniedbyallassociatedwarranties,conditions,limitations,cknowledgesandagreesthatitissolelyresponsibleforcompliancewithalllegal,regulatoryandsafety-relatedrequirementsconcerningitsproducts,andanyuseofTIcomponentsinitsapplications,notwithstandingaepresentsandagreesthatithasallthenecessaryexpertisetocreateandimplementsafeguardsthatanticipatedangerousfailures,monitorfailuresandtheirconsequences,lessenthillfullyindemnifyTIanditsrepresentativesagainstanydamagesarisingoutoftheuseofanyTIcomponentsinBuyer’cases,TIcomponentschcomponents,TI’sgoalistohelpenablecustomerstodesignandcreatetheirownend-productsolueless,mponentsareauthorizedforuseinFDAClassIII(orsimilarlife-criticalmedicalequipment)unlessauthorizedofficersoseTIcomponentsthatTIhasspecificallydesignatedasmilitarygradeor“enhancedplastic”aredesignedandintendedforuseinmilitary/cknowledgesandagreesthatanymilitaryoraerospaceuseofTIcomponentsthathavenotbeensodesignatedissolelyatBuyer'srisk,andBuyerissolelyresponsibleforcompliapecificallydesignatedcertaincomponentsasmeetingISO/TS16949requirements,aseofuseofnon-designatedproducts,TIwillnotberesponsibleforanyfailuretomeetISO/gAddress:TexasInstruments,PostOfficeBox655303,Dallas,Texas75265Copyright©2013,TexasInstrumentsIncorporated

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