Edge clip terminal for mounting thick film hybrid

2024-07-29 作者:

专利内容由知识产权出版社提供

专利名称：Edge clip terminal for mounting thick film

hybrid circuits in printed circuit boards

发明人：Paul R. Ellis, Jr.申请号：US06/000417申请日：19790102公开号：US04257668A公开日：19810324

摘要：An improved edge clip terminal having a first diamond-shaped transition regionconnecting a plurality of tines, that clip over the edge of a substrate, to a first leadsection and having a second diamond- shaped transition region connecting the first leadsection to a second lead section. In an assembly, the second lead sections of a plurality ofterminals are located in holes in a PC board with the second transition regions resting onthe surface of the circuit board. The first lead sections are more narrow than thetransition regions and of lengths that are sufficient for preventing solder wicking upthem and into the areas of the tines during wave soldering of a circuit board so that aleaded substrate soldered into the circuit board may be tilted without damaging it. In analternate embodiment of this invention, the lead portion of an edge clip terminal on asubstrate has a pair of spaced apart transition regions in it. A first transition region andfirst length of lead space tines away from a second transition region in a hole in a circuitboard for preventing solder wicking up the lead and tines during wave soldering so thatthe leaded substrate may be tilted without damaging it.

申请人：GTE AUTOMATIC ELECTRIC LABORATORIES, INC.

代理人：Russell A. Cannon

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