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LFPAK56

LFPAK56 MOSFETs - LFPAK56 | Nexperia

Nexperia’s LFPAK56 portfolio gives industry leading performance in a truly innovative package. 100 % compatible with industry-standard Power-SO8 footprints, the design and construction is optimized to give the best thermal and electrical performance, cost and reliability.

Documentation

文件名称标题类型日期
AN11158Understanding power MOSFET data sheet parametersApplication note2020-07-06
nexperia_document_leaflet_LFPAK56_LR_2020The automotive Power-SO8 that packs a punchLeaflet2020-04-22
nexperia_document_leaflet_LFPAK56_CHN_2020LFPAK56 车规级Power-SO8性能强劲Leaflet2020-05-01
AN90003LFPAK MOSFET thermal design guideApplication note2021-01-22
Nexperia_package_posterNexperia package posterLeaflet2019-03-01
AN90016Maximum continuous currents in NEXPERIA LFPAK power MOSFETsApplication note2020-09-03
AN90019LFPAK MOSFET thermal resistance - simulation, test and optimization of PCB layoutApplication note2020-07-20

Thermal performance

  • No wires, no glue
  • 175 °C Tj max

Electrical performance

  • Low package resistance and inductance
  • Current handling up to 100 A

Cost

  • Fewer manufacturing steps means cost-effective, high volume production

Mechanical Robustness

  • Exposed leads absorb thermal and mechanical stresses

Manufacturability

  • Easy optical inspection of solder joints
  • Low package height
  • Wave solderable

Compatibility

  • 100 % compatible with industry-standard footprints

Innovative clip-bonding

Unlike competitor Power-SO8 types which are constructed using wire bonding, Nexperia’s LFPAK56 uses a copper clip which is soldered in a single operation to the gate and source. This reduces spreading resistance, and gives LFPAK56 superior electrical and thermal characteristics as well as increased reliability.

Resists mechanical and thermal stress

Customer feedback consistently shows that LFPAK56 is more reliable and rugged than competitor QFN and other micro-lead devices. The LFPAK56 meets full automotive qualification (AEC-Q101), clear proof of its superior ruggedness and reliability in the toughest conditions. LFPAK’s innovative construction allows the gate and source pins to ‘flex’ and safely absorb the mechanical stresses that occur when a device is rapidly heated and cooled.


        

 

 

Soldering and footprint compatibility

There are many power MOSFETs available in the Power-SO8 family. However as there is no generic JEDEC standard for Power-SO8 devices, each device generally has a different PCB footprint and none of the manufacturer’s devices are guaranteed to be interchangeable with other devices. LFPAK56 achieves electrical and mechanical compatibility with industry-standard footprints, as shown below.


 

Related documents:

  • Package outline drawing, wave and reflow footprint for soldering
  • Packing methods
  • LFPAK thermal design guide https://assets.nexperia/documents/application-note/AN90003.pdf

LFPAK MOSFET thermal design guide

https://assets.nexperia/documents/application-note/AN90003.pdf

 

LFPAK MOSFET thermal design guide

https://assets.nexperia/documents/application-note/AN90003.pdf

Maximum continuous currents in NEXPERIA LFPAK power MOSFETs

https://assets.nexperia/documents/application-note/AN90016.pdf

LFPAK MOSFET thermal resistance - simulation, test and optimization of PCB layout

https://assets.nexperia/documents/application-note/AN90019.pdf

 

Understanding power MOSFET data sheet parameters

https://assets.nexperia/documents/application-note/AN11158.pdf

本文标签： MOSFETNexperiaparameterThermal

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